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AD5251/AD5252
Rev.0 | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted .
Table 4.
Parameter
Rating
VDD to GND
−0.3 V, +7 V
VSS to GND
+0.3 V, −7 V
VDD to VSS
7 V
VA, VB, VW to GND
VSS, VDD
Maximum Current
IWB, IWA Pulsed
±20 mA
IWB Continuous (RWB ≤ 1 kΩ, A Open)1
±5 mA
IWA Continuous (RWA ≤ 1 kΩ, B Open)
1
±5 mA
IAB Continuous
(RAB = 1 kΩ/10 kΩ/50 kΩ/100 kΩ)
1
±5 mA/±500 µA/
±100 µA/±50 µA
Digital Inputs and Output Voltage
to GND
0 V, 7 V
Operating Temperature Range
−40°C to +85°C
Maximum Junction Temperature
(TJ MAX)
150°C
Storage Temperature
−65°C to +150°C
Lead Temperature (Soldering,10 sec)
300°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
TSSOP-14 Thermal Resistance2 θJA
136°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1 Maximum terminal current is bounded by the maximum applied voltage
across any two of the A, B, and W terminals at a given resistance, the
maximum current handling of the switches, and the maximum power
dissipation of the package. VDD = 5 V.
2 Package power dissipation = (TJMAX − TA)/θJA.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.


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