4

LM2623-Q1

SNVSAO5 – OCTOBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input pins

SW pin voltage

–0.5

14.5

V

BOOT, VDD, EN, and FB pins

–0.5

10

V

FREQ pin

100

µA

(3)

500

mW

(3)

150

°C

–55

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

All pins except 12 and 13

±2000

V

Pins 12 and 13

±1000

Charged device model (CDM), per AEC Q100-011

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input pins

3

5

V

FB and EN pins

0

V

BOOT pin

0

10

V

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

LM2623-Q1

UNIT

NHL (WSON)

14 PINS

Junction-to-ambient thermal resistance

37.6

°C/W

Junction-to-case (top) thermal resistance

26.9

°C/W

Junction-to-board thermal resistance

15.0

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

4.7

°C/W