33394

6

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

Voltage parameters are absolute voltages referenced to ground.)

Parameter

Min.

Max.

Unit

Supply Voltage (VBAT), Load Dump

–0.3

+45

V

Supply Voltage (KA_VBAT, VIGN), Load Dump

–18

+45

V

Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)

–0.3

+5.8

V

Supply Voltages (VREF1, VREF2, VREF3, VSEN)

–2.0

+18

V

CANL, CANH (0<VBAT<18 VDC no time limit)

–18

+26.5

V

ESD Voltage

Human Body Model all pins

(Note 1)

Machine Model all pins

(Note 2)

–2.0

–200

+2.0

+200

kV

V

CANLesd, CANHesd

(Note 1)

–4.0

+4.0

kV

CANLesd, CANHesd

(Note 2)

–200

+200

V

CANLtransient, CANHtransient

(Note 3)

–200

+200

V

/SLEEP

–18

+45

V

REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK

–0.3

+7.0

V

CANTXD, CANRXD

–0.3

+7.0

V

Operational Package Temperature [Ambient Temperature]

–40

+125

°C

Storage Temperature

–65

+150

°C

Power Dissipation (TA = 125_C)

44 HSOP

(Note 4)

44 QFN

(Note 4)

54 SOICW–EP

(Note 4)

8.3

5.0

5.0

W

W

W

Lead Soldering Temperature

(Note 5)

260

_C

Maximum Junction Temperature

+150

°C

R

θJA, Thermal Resistance, Junction to Ambient (44 HSOP)

(Note 6)

41

°C/W

R

θJC, Thermal Resistance, Junction to Case (44 HSOP)

(Note 7)

0.2

°C/W

R

θJB, Thermal Resistance, Junction to Base (44 HSOP)

(Note 8)

3

°C/W

R

θJA, Thermal Resistance, Junction to Ambient (44 QFN)

(Note 6)

77

°C/W

R

θJC, Thermal Resistance, Junction to Case (44 QFN)

(Note 7)

1.7

°C/W

R

θJB, Thermal Resistance, Junction to Base (44 QFN)

(Note 8)

5.0

°C/W

R

θJA, Thermal Resistance, Junction to Ambient (54 SOICW–EP)

(Note 6)

52

°C/W

R

θJC, Thermal Resistance, Junction to Case (54 SOICW–EP)

(Note 7)

1.2

°C/W

R

θJB, Thermal Resistance, Junction to Base (54 SOICW–EP)

(Note 8)

8.1

°C/W

1. Human body model: C = 100 pF, R = 1.5 k

Ω.

2. Machine model: C = 200 pF, R = 10

Ω and L = 0.75 µH. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100

V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.

3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.

4. Maximum power dissipation at indicated junction temperature.

5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering

time/temperature limits.

6. Thermal resistance measured in accordance with EIA/JESD51–2.

7. Theoretical thermal resistance from the die junction to the exposed pad.

8. Thermal resistance measured in accordance with JESD51–8.

Parameter

Value

Unit

Supply Voltages (VBAT, KA_VBAT)

4.0 to 26.5

V

Switching Regulator Output Current (IVPRE)

(Note 1)

0 to 1.2

A

VDDH Output Current

0 to 400

mA

VDD3_3 Output Current

0 to 120

mA

VDDL_B Pass Transistor Base Drive Current

0 to 40

mA

VPP Output Current

0 to 150

mA

VREF Output Current

0 to 100

mA

VSEN Output Current

0 to 125

mA

VKAM Standby Output Current (normal mode of operation)

0 to 60

mA

VKAM Standby Output Current (standby mode of operation)

0 to 12

mA

1. See Typical Application Diagram in Figure 1.