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LM741CH bảng dữ liệu(PDF) 4 Page - Texas Instruments

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LM741-MIL
SNOSD62 – JUNE 2017
www.ti.com
Product Folder Links: LM741-MIL
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those specified in the Recommended
Operating Conditions table. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
For military specifications see RETS741X for LM741-MIL and RETS741AX for LM741-MILA.
(3)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4)
For operation at elevated temperatures, these devices must be derated based on thermal resistance, and TJ(max). (listed in the Absolute
Maximum Ratings table). Tj = TA + (θJA × PD).
(5)
For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage
±22
V
Power dissipation (4)
500
mW
Differential input voltage
±30
V
Input voltage (5)
±15
V
Output short circuit duration
Continuous
Operating temperature
–50
125
°C
Junction temperature, TJ(max)
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±400
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage (VDD-GND)
±10
±15
±22
V
Temperature
–55
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
LM741-MIL
UNIT
LMC (TO-99)
NAB (CDIP)
P (PDIP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
170
100
100
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
25
°C/W


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