4

LM317HV-MIL

SNVSAY1 – JUNE 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

See

MIN

MAX

UNIT

Power dissipation

Internally limited

Input–output voltage differential

−0.3

60

V

Lead temperature (soldering, 10 seconds)

300

°C

−65

150

°C

(1)

Manufacturing with less than 500-V HBM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature

0

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

No Heat Sink

6.4 Thermal Information

LM317HV

UNIT

NDT

(TO-39)

NDS

(TO-3)

NDE

(TO-220)

3 PINS

2 PINS

3 PINS

Junction-to-ambient thermal resistance

23.0

°C/W

Junction-to-case (top) thermal resistance

12

2.3

15.9

°C/W

Junction-to-board thermal resistance

—

—

4.6

°C/W

Junction-to-top characterization parameter

—

—

2.5

°C/W

Junction-to-board characterization parameter

—

—

4.6

°C/W

Junction-to-case (bottom) thermal resistance

—

—

0.9

°C/W