LM311-MWC datasheet(4/25 Pages) TI1

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LM311-MIL

SLCS163 – JUNE 2017

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Product Folder Links: LM311-MIL

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(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC+ – VCC–

Supply voltage

3.5

30

V

VI

Input voltage (|VCC+| ≤ 15 V)

VCC– + 0.5

VCC+ – 1.5

V

TA

Operating free-air temperature range

0

70

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM311-MIL

UNIT

D (SOIC)

P (PDIP)

PW

(TSSOP)

PS (SO)

8 PINS

RθJA

Junction-to-ambient thermal resistance

114.3

57.5

162

121.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

60.7

47.3

44.6

81.6

°C/W

RθJB

Junction-to-board thermal resistance

54.5

34.6

93

66.5

°C/W

ψJT

Junction-to-top characterization parameter

17.4

24.9

2.6

31.4

°C/W

ψJB

Junction-to-board characterization parameter

54

34.5

90.8

65.8

°C/W

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