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9 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1016_C0G_ARRAY_SMD • 10/14/2016 99 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish SnPb 100% Matte Sn Preheat/Soak Temperature Minimum (T Smin) 100°C 150°C Temperature Maximum (T Smax) 150°C 200°C Time (t S) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds Ramp-Up Rate (T L to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (T L) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 60 – 150 seconds Peak Temperature (T P) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (t P) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (T P to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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