MIL-STD-1553B Multiplex DataBus Box Couplers and

Terminators Connectorized with D-6025 Connector

Interface

D-6021

Revision A1

25-Mar-15

© 2015 Tyco Electronics Corporation, a TE Connectivity Ltd. Company. All Rights Reserved. TE Proprietary & Confidential Information.

If this document is printed, it becomes uncontrolled. Check for latest revision.

Page 10 of 14

4.5

Test Procedures

4.5.1

Test Conditions. Unless otherwise specified, all tests shall be performed at ambient

temperature, pressure, and relative humidity as specified in the general

requirements of MIL-STD-202. Tolerances for test conditions shall meet the

general requirements of MIL-STD-202 and MIL-STD-810.

4.5.2

Visual Examination. Specimens shall be visually examined to ensure conformance

with 3.1, 3.4, and 3.5 of this specification.

4.5.3

Functional Tests

4.5.3.1

Box Coupler Input Impedance (see 3.6.1.2). Input impedance shall be

measured as described in MIL-STD-1553B at room temperature and at

the temperature rating extremes.

4.5.3.2 Box Coupler Waveform Integrity Test (see 3.6.1.3) Box couplers shall be

tested using the test configuration shown in Figure 1. The maximum

terminal output voltage of 27 V p-p shall be applied at point A using the

wave- form specified in MIL-STD-1553B, paragraph 4.5.1.5.1.1.2 (250 kHz

frequency). Droop, overshoot and ringing shall be measured on the bus

leads at point B.

Figure 1 Box Coupler Waveform Integrity Test

4.5.3.3 Box Coupler Maximum Voltage Test (see 3.6.1.4). Box couplers shall be

tested using the test configurations shown in Figures 2 and 3,

respectively. The maximum terminal output voltage of 27 V p-p shall be

applied at V1 using the 250 kHz waveform described in 4.5.3.2. The

output voltage shall be measured at V2. This test shall then be repeated

using a 1 MHz waveform similar to that described in 4.5.3.2.