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900-0380801 bảng dữ liệu(PDF) 5 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  Low-Quiescent-Current, Programmable-Delay Supervisory Circuit
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900-0380801 bảng dữ liệu(HTML) 5 Page - Texas Instruments

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TPS3808
www.ti.com
SBVS050K – MAY 2004 – REVISED OCTOBER 2015
Product Folder Links: TPS3808
Submit Documentation Feedback
Copyright © 2004–2015, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
As a result of the low dissipated power in this device, it is assumed that TJ = TA.
7 Specifications
7.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage
VDD
–0.3
7
V
VCT
–0.3
VDD + 0.3
V
VRESET, VMR, VSENSE
–0.3
7
V
Current
RESET pin
–5
5
mA
Temperature
Operating junction, TJ
(2)
–40
150
°C
Storage, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins(2)
±500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
Input supply range
1.7
6.5
V
VSENSE
SENSE pin voltage
0
6.5
V
V(Ct)
CT pin voltage
VDD
V
VMR
MR pin voltage
0
6.5
V
VRESET
RESET pin voltage
0
6.5
V
IRESET
RESET pin current
0.0003
5
mA
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
TPS3808
UNIT
DBV (SOT-23)
DRV (WSON)
6 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
180.9
178.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
117.8
95.6
°C/W
RθJB
Junction-to-board thermal resistance
27.8
135
°C/W
ψJT
Junction-to-top characterization parameter
1.12
6.3
°C/W
ψJB
Junction-to-board characterization parameter
27.3
136.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
7.3
°C/W


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