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5V41235PGG bảng dữ liệu(PDF) 4 Page - Integrated Device Technology |
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5V41235PGG bảng dữ liệu(HTML) 4 Page - Integrated Device Technology |
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4 / 18 page  5V41235 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER IDT® 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER 4 5V41235 MAY 5, 2017 Applications Information External Components A minimum number of external components are required for proper operation. Decoupling Capacitors Decoupling capacitors of 0.01 F should be connected between each VDD pin and the ground plane, as close to the VDD pin as possible. Do not share ground vias between components. Route power from power source through the capacitor pad and then into ICS pin. Crystal A 25 MHz fundamental mode parallel resonant crystal should be used. This crystal must have less than 300 ppm of error across temperature in order for the 5V41235 to meet PCI Express specifications. Crystal Capacitors Crystal capacitors are connected from pins X1 to ground and X2 to ground to optimize the accuracy of the output frequency. CL= Crystal’s load capacitance in pF Crystal Capacitors (pF) = (CL- 7) * 2 For example, for a crystal with a 8pF load cap, each external crystal cap would be 2pF [(8-7)*2=2]. Current Source (Iref) Reference Resistor - RR If board target trace impedance (Z) is 50 , then R R = 475 (1%), providing IREF of 2.32 mA. The output current (IOH) is equal to 6*IREF. Output Termination The PCI-Express differential clock outputs of the 5V41235 are open source drivers and require an external series resistor and a resistor to ground. These resistor values and their allowable locations are shown in detail in the PCI-Express Layout Guidelines section. The 5V41235 can also be configured for LVDS compatible voltage levels. See the LVDS Compatible Layout Guidelines section. Output Structures General PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1. Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. 2. No vias should be used between decoupling capacitor and VDD pin. 3. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical. 4. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (any ferrite beads and bulk decoupling capacitors can be mounted on the back). Other signal traces should be routed away from the 5V41235.This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. R R 475 6*IREF =2.3 mA IREF See Output Termination Sections - Pages 3 ~ 5 |
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