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6 / 255 page Contents STM32F765xx STM32F767xx STM32F768Ax STM32F769xx 6/255 DocID029041 Rev 4 5.3.25 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.3.26 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.3.27 Reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 5.3.28 DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 5.3.29 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 5.3.30 FMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 5.3.31 Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 5.3.32 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 217 5.3.33 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 218 5.3.34 Digital filter for Sigma-Delta Modulators (DFSDM) characteristics . . . 220 5.3.35 DFSDM timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 5.3.36 SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 223 6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 6.1 LQFP100 14x 14 mm, low-profile quad flat package information . . . . . . 225 6.2 LQFP144 20 x 20 mm, low-profile quad flat package information . . . . . 229 6.3 LQFP176 24 x 24 mm, low-profile quad flat package information . . . . . 233 6.4 LQFP208 28 x 28 mm low-profile quad flat package information . . . . . . 237 6.5 WLCSP 180-bump, 5.5 x 6 mm, wafer level chip scale package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 6.6 UFBGA176+25, 10 x 10, 0.65 mm ultra thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 6.7 TFBGA216, 13 x 13 x 0.8 mm thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 6.8 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252 Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 253 A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254 |
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Mô tả tương tự - STM32F769BG |
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