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LM2759
www.ti.com
SNVS577D – JUNE 2008 – REVISED MAY 2013
Absolute Maximum Ratings
(1) (2) (3)
VIN pin: Voltage to GND
-0.3V to 6.0V
Strobe, TX, SDA, SCL, ISINK pins: Voltage to GND
-0.3V to (VIN + 0.3V)
w/ 6.0V max
Continuous Power Dissipation(4)
Internally Limited
Junction Temperature (TJ-MAX)
150°C
Storage Temperature Range
-65°C to 150°C
Maximum Lead Temp. (Soldering)
(5)
ESD Rating
Human Body Model(6)
2.5KV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential to the GND pin.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and
disengages at TJ = 120°C (typ.).
(5)
For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1187 (SNOA401).
(6)
The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. (MIL-STD-883 3015.7)
Operating Ratings
(1) (2)
Input Voltage Range
2.7V to 5.5V
LED Voltage Range
2.0V to 4.0V
Junction Temperature Range (TJ)
-30°C to +125°C
Ambient Temperature Range (TA)
(3)
-30°C to +85°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential to the GND pin.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP - (θJA × PD-MAX).
Thermal Information
Junction-to-Ambient Thermal Resistance, (
θJA),
(1)
36.7°C/W
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4–layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array
of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 53µm/35µm/35µm/53µm
(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.The value of
θJA of this product in the
WSON package could fall in a range as wide as 30ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and
environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid
to thermal dissipation issues. For more information on these topics, please refer to Application Note AN-1187 (SNOA401): and the
Power Efficiency and Power Dissipation section of this datasheet.
Copyright © 2008–2013, Texas Instruments Incorporated
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