CYStech Electronics Corp.

Spec. No. : C050H8

Issued Date : 2017.04.05

Revised Date : 2017.04.10

Page No. : 10/11

MTB9D0P03H8

CYStek Product Specification

Recommended wave soldering condition

Product

Peak Temperature

Soldering Time

Pb-free devices

260 +0/-5

°C

5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature

Sn-Pb eutectic Assembly

Pb-free Assembly

Average ramp-up rate

(Tsmax to Tp)

3

°C/second max.

3

°C/second max.

Preheat

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

183

°C

60-150 seconds

Time maintained above:

217

°C

60-150 seconds

240 +0/-5

°C

260 +0/-5

°C

Time within 5

°C of actual peak

10-30 seconds

20-40 seconds

temperature(tp)

Ramp down rate

6

°C/second max.

6

°C/second max.

6 minutes max.

8 minutes max.

Time 25

°C to peak temperature

Note :1. All temperatures refer to topside of the package, measured on the package body surface.

2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care

should be taken to match the coefficients of thermal expansion between components and PCB. If they are

not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly

cools.