MC74VHC139

http://onsemi.com

3

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

–0.5 to +7.0

V

DC Input Voltage

–0.5 to +7.0

V

DC Output Voltage

V

Input Diode Current

−20

mA

Output Diode Current

±20

mA

DC Output Current, per Pin

±25

mA

±75

mA

Power Dissipation in Still Air,

500

450

mW

Storage Temperature

–65 to +150

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings

applied to the device are individual stress limit values (not normal operating conditions) and are

not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

†Derating − SOIC Packages: – 7 mW/°C from 65° to 125°C

TSSOP Package: − 6.1 mW/°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage

2.0

5.5

V

DC Input Voltage

0

5.5

V

DC Output Voltage

0

V

Operating Temperature

−55

+125

°C

Input Rise and Fall Time

(Figure 3)

0

0

100

20

ns/V

expected lifetime of the device per the table and figure below.

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature (°C)

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 5. Failure Rate vs. Time

Junction Temperature

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.