© Semiconductor Components Industries, LLC, 2011

November, 2011 − Rev. 11

1

Publication Order Number:

BCP69T1/D

BCP69T1G, NSVBCP69T1G

PNP Silicon

Epitaxial Transistor

This PNP Silicon Epitaxial Transistor is designed for use in low

voltage, high current applications. The device is housed in the

SOT−223 package, which is designed for medium power surface

mount applications.

Features

thermal conduction, and allows visual inspection of soldered joints.

The formed leads absorb thermal stress during soldering, eliminating

the possibility of damage to the die.

Unique Site and Control Change Requirements

Compliant

Rating

Symbol

Value

Unit

Collector−Emitter Voltage

−20

Vdc

Collector−Base Voltage

−25

Vdc

Emitter−Base Voltage

−5.0

Vdc

Collector Current

−1.0

Adc

Derate above 25°C

1.5

12

W

mW/°C

Operating and Storage Temperature Range

−65 to

150

°C

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance − Junction−to−Ambient

(Surface Mounted)

83.3

°C/W

Lead Temperature for Soldering,

0.0625 in from case

Time in Solder Bath

260

10

°C

s

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.

x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.

MEDIUM POWER

PNP SILICON

HIGH CURRENT

TRANSISTOR

SURFACE MOUNT

1

2

3

4

COLLECTOR 2,4

BASE

1

EMITTER 3

http://onsemi.com

SOT−223 (TO−261)

CASE 318E

STYLE 1

AYW

CEG

G

Device

Package

ORDERING INFORMATION

BCP69T1G

SOT−223

(Pb−Free)

1000 / Tape & Reel

CE = Specific Device Code

A

= Assembly Location

Y

= Year

W

= Work Week

G

= Pb−Free Package

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MARKING

DIAGRAM

(*Note: Microdot may be in either location)

NSVBCP69T1G

SOT−223

(Pb−Free)

1000 / Tape & Reel