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ADC32RF44 bảng dữ liệu(PDF) 5 Page - Texas Instruments

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tên linh kiện ADC32RF44
Giải thích chi tiết về linh kiện  Dual-Channel, 14-Bit, 2.6-GSPS, Analog-to-Digital Converter
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5
ADC32RF44
www.ti.com
SBAS809 – FEBRUARY 2017
Product Folder Links: ADC32RF44
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage range
AVDD19
–0.3
2.1
V
AVDD
–0.3
1.4
DVDD
–0.3
1.4
Voltage applied to input pins
INAP, INAM and INBP, INBM
–0.3
AVDD19 + 0.3
V
CLKINP, CLKINM
–0.3
AVDD + 0.6
SYSREFP, SYSREFM, SYNCBP, SYNCBM
–0.3
AVDD + 0.6
SCLK, SEN, SDIN, RESET, PDN, GPIO1, GPIO2,
GPIO3, GPIO4
–0.2
AVDD19 + 0.2
Voltage applied to output pins
–0.3
2.2
V
Temperature
Operating free-air, TA
–40
85
°C
Storage, Tstg
–65
150
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
Always power up the DVDD supply (1.15 V) before the AVDD19 (1.9 V) supply. The AVDD (1.15 V) supply can come up in any order.
(2)
Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage(1)
AVDD19
1.8
1.9
2.0
V
AVDD
1.1
1.15
1.25
DVDD
1.1
1.15
1.2
Temperature
Operating free-air, TA
–40
85
°C
Operating junction, TJ
105(2)
125
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
ADC32RF44
UNIT
RMP (VQFN)
72 PINS
RθJA
Junction-to-ambient thermal resistance
21.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
4.4
°C/W
RθJB
Junction-to-board thermal resistance
2.0
°C/W
ψJT
Junction-to-top characterization parameter
0.1
°C/W
ψJB
Junction-to-board characterization parameter
2.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.2
°C/W


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