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AD5675BRUZ bảng dữ liệu(PDF) 8 Page - Analog Devices

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Data Sheet
AD5675
Rev. B | Page 7 of 26
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
VLOGIC to GND
−0.3 V to +7 V
VOUTx to GND
−0.3 V to VDD + 0.3 V
VREF to GND
−0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
−0.3 V to VLOGIC + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
125°C
Reflow Soldering Peak Temperature,
Pb-Free (J-STD-020)
260°C
ESD Ratings
Human Body Model (HBM)
2 kV
Field Induced Charged Device Model
(FICDM)
1.5 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
The design of the thermal board requires close attention. Thermal
resistance is highly impacted by the printed circuit board (PCB)
being used, layout, and environmental conditions.
Table 6. Thermal Resistance
Package Type
θJA
θJB
θJC
ΨJT
ΨJB
Unit
20-Lead TSSOP
(RU-20)1
98.65
44.39
17.58
1.77
43.9
°C/W
20-Lead LFCSP
(CP-20-8)2
82
16.67
32.5
0.43
22
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD51
2 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with nine thermal vias. See JEDEC JESD51.
ESD CAUTION


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