PZTA42T1G

www.onsemi.com

4

PACKAGE DIMENSIONS

SOT−223 (TO−261)

CASE 318E−04

ISSUE N

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.5

0.059

mm

inches

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

A1

b1

D

E

b

e

e1

4

12

3

0.08 (0003)

A

L1

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.50

1.63

1.75

0.060

INCHES

A1

0.02

0.06

0.10

0.001

b

0.60

0.75

0.89

0.024

b1

2.90

3.06

3.20

0.115

c

0.24

0.29

0.35

0.009

D

6.30

6.50

6.70

0.249

E

3.30

3.50

3.70

0.130

e

2.20

2.30

2.40

0.087

0.85

0.94

1.05

0.033

0.064

0.068

0.002

0.004

0.030

0.035

0.121

0.126

0.012

0.014

0.256

0.263

0.138

0.145

0.091

0.094

0.037

0.041

NOM

MAX

L1

1.50

1.75

2.00

0.060

6.70

7.00

7.30

0.264

0.069

0.078

0.276

0.287

−

−

e1

0

°

10

°

0

°

10

°

q

q

L

L

0.20

−−−

−−−

0.008

−−−

−−−

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