HCPL0708 datasheet(3/10 Pages) HP

tên linh kiện	HCPL0708

Giải thích chi tiết về linh kiện	High Speed CMOS Optocoupler

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Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Minimum External Air

L(I01)

4.9

mm

Measured from input terminals to output

Gap (Clearance)

terminals, shortest distance through air.

Minimum External

L(I02)

4.8

mm

Measured from input terminals to output

Tracking (Creepage)

terminals, shortest distance path along body.

Minimum Internal Plastic

0.08

mm

Insulation thickness between emitter and

Gap (Internal Clearance)

detector; also known as distance through

insulation.

Tracking Resistance

CTI

≥175

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Solder Reflow Thermal Profile

All Agilent data sheets report the

creepage and clearance inherent

to the optocoupler component

itself. These dimensions are

needed as a starting point for the

equipment designer when

determining the circuit insulation

requirements. However, once

mounted on a printed circuit

board, minimum creepage and

clearance requirements must be

met as specified for individual

equipment standards. For

creepage, the shortest distance

path along the surface of a

printed circuit board between the

solder fillets of the input and

output leads must be considered.

There are recommended

techniques such as grooves and

ribs which may be used on a

printed circuit board to achieve

desired creepage and clearances.

Creepage and clearance distances

will also change depending on

factors such as pollution degree

and insulation level.

Regulatory Information

The HCPL-0708 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

component recognition program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File

CA88324.

VDE

Approved according to

VDE 0884/06.92,

File 6591-23-4880-1005.

TUV

Approved according to

VDE 0884/06.92, Certificate

R9650938.

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

Số phần tương tự - HCPL0708

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