công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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LM4841LQ bảng dữ liệu(PDF) 6 Page - National Semiconductor (TI) |
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LM4841LQ bảng dữ liệu(HTML) 6 Page - National Semiconductor (TI) |
6 / 31 page Typical Performance Characteristics MH/LQ Specific Characteristics LM4841MH/LQ THD+N vs Output Power LM4841MH/LQ THD+N vs Frequency 20028070 20028071 LM4841MH/LQ THD+N vs Output Power LM4841MH/LQ THD+N vs Frequency 20028072 20028073 LM4841MH/LQ Power Dissipation vs Output Power LM4841MH/LQ (Note 17) Power Derating Curve 20028065 20028064 Note 17: These curves show the thermal dissipation ability of the LM4841MH/LQ at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. www.national.com 6 |
Số phần tương tự - LM4841LQ |
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Mô tả tương tự - LM4841LQ |
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