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LM4840LQ bảng dữ liệu(PDF) 5 Page - National Semiconductor (TI) |
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LM4840LQ bảng dữ liệu(HTML) 5 Page - National Semiconductor (TI) |
5 / 19 page MH and LQ Specific Characteristics Note 17: These curves show the thermal dissipation ability of the LM4840MH at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Typical Performance Characteristics LM4840MH, LM4840LQ THD+N vs Output Power DS200104-70 LM4840MH, LM4840LQ THD+N vs Frequency DS200104-71 LM4840MH, LM4840LQ THD+N vs Output Power DS200104-72 LM4840MH, LM4840LQ THD+N vs Frequency DS200104-73 LM4840MH, LM4840LQ Power Dissipation vs Output Power DS200104-65 LM4840MH(Note 17) Power Derating Curve DS200104-64 THD+N vs Frequency DS200104-57 THD+N vs Frequency DS200104-58 THD+N vs Frequency DS200104-14 www.national.com 5 |
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