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LM4652TA bảng dữ liệu(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện LM4652TA
Giải thích chi tiết về linh kiện  LM4651 & LM4652 Overture??Audio Power Amplifier 170W Class D Audio Power Amplifier Solution
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LM4652 Pin Descriptions
Pin No.
Symbol
Description
1
GND
A ground reference for the thermal shut down circuitry.
2LG
1
Low−Gate #1 is the gate input to a bottom side MOSFET in the H-Bridge.
3−V
EE
The negative voltage supply input for the power MOSFET H-Bridge.
4
TSD
The thermal shut down flag pin. This pin transitions to 6V when the die temperature
exceeds 150˚C.
5
NC
No connection
6LG
2
Low−Gate #2 is the gate input to a bottom side MOSFET in the H-Bridge.
7VO
2
The switching output pin for one side of the H-Bridge.
8
NC
No connection.
9
NC
No connection.
10
HG
2
High−Gate #2 is the gate input to a top side MOSFET in the H-Bridge.
11
NC
No connection.
12
NC
No connection.
13
+V
CC
The positive voltage supply input for the power MOSFET H-Bridge.
14
HG
1
High−Gate #1 is the gate input to a top side MOSFET in the H-Bridge.
15
VO
2
The switching output pin for one side of the H-Bridge.
Note: NC, no connect pins are floating pins. It is best to connect the pins to GND to minimize any noise from being coupled into
the pins.
External Components Description (Refer to Figure 1)
Components
Functional Description
1.
R
1
Works with R
2,Rfl1 and Rfl2 to set the gain of the system. Gain = [(R2/R1) x ((Rfl1 +
R
fl2)/ Rfl2)−(R2/R1) + .5].
2.
R
2
See description above for R
1.
3.
R
f
Sets the gain and bandwidth of the system by creating a low pass filter for the Error
Amplifier’s feedback with C
f. 3dB pole is at fC = 1/(2πRfCf) (Hz).
4.
C
f
See description above for R
f.
5.
R
fI1
Provides a reduction in the feedback with R
fI2.RfI1should be 10 X RfI2 minimum to
reduce effects on the pole created by R
fI2 and CfI1. See also note for R1,R2 for effect on
System Gain.
6.
R
fI2
R
fI2 and CfI1 creates a low pass filter with a pole at fC = 1/(2πRfI2CfI1) (Hz). See also
note for R
1,R2 for effect on System Gain.
7.
C
fI1
See description above for R
fI2.
8.
R
fI3
Establish the second pole for the low pass filter in the feedback path at f
C =
1/(2
πR
fI3CfI2) (Hz).
9.
C
fI2
See description above for R
fI3.
10.
L
1
Combined with C
BYP creates a 2−pole, low pass output filter that has a −3dB pole at fC
= 1/[2
π(L
12CBYP)
1
2
] (Hz).
11.
C
1
Filters high frequency noise from the amplifier’s output to ground. Recommended value
is 0.1µF to 1µF.
12.
C
byp
See description for L
1.
13.
C
B1−CB4
Bypass capacitors for V
CC,VEE, analog and digital voltages (VDD, +6V, −6V). See
Supply Bypassing and High Frequency PCB Design in the Application Information
section for more information.
14.
B
BT
Provides the bootstrap capacitance for the boot strap pin.
15.
R
DLY
Sets the dead time or break before make to T
DLY = (1.7x10
−12)(500+R
DLY) (seconds).
16.
C
START
Controls the startup time with T
START = (8.5x10
4)C
START (seconds).
17.
R
SCKT
Sets the output short circuit current with I
SCKT = (1x10
5)/ (10k
Ω\ R
SCKT) (A).
18.
R
OSC
Controls the switching frequency with f
SW = 1X10
9 / (4000 + R
OSC) (Hz).
19.
D
1
Schottky diode to protect the output MOSFETs from fly back voltages.
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