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ADC3241 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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ADC3241 bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 71 page 4 THS4552 SBOS831 – DECEMBER 2016 www.ti.com Product Folder Links: THS4552 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Solder the exposed thermal pad (RTW package) to a heat-spreading power or ground plane. This pad is electrically isolated from the die, but must be connected to a power or ground plane and not floated. Pin Functions PIN I/O DESCRIPTION NAME NO. RTW(1) PW FB1– 23 — O Channel 1, inverting (negative) output feedback FB2– 5 — O Channel 2, inverting (negative) output feedback FB1+ 2 — O Channel 1, noninverting (positive) output feedback FB2+ 8 — O Channel 2, noninverting (positive) output feedback IN1– 1 3 I Channel 1, inverting (negative) amplifier input IN2– 7 7 I Channel 2, inverting (negative) amplifier input IN1+ 24 2 I Channel 1, noninverting (positive) amplifier input IN2+ 6 6 I Channel 2, noninverting (positive) amplifier input OUT1– 19 15 O Channel 1, inverting (negative) amplifier output OUT2– 13 11 O Channel 2, inverting (negative) amplifier output OUT1+ 18 14 O Channel 1, noninverting (positive) amplifier output OUT2+ 12 10 O Channel 2, noninverting (positive) amplifier output PD1 20 1 I Channel 1, power-down. PD = logic low = power off mode; PD = logic high = normal operation. PD2 14 5 I Channel 2, power-down. PD = logic low = power off mode; PD = logic high = normal operation. VOCM1 17 4 I Channel 1, common-mode voltage input VOCM2 11 8 I Channel 2, common-mode voltage input VS1– 21, 22 16 I Channel 1, negative power-supply input VS2– 15.16 12 I Channel 2, negative power-supply input VS1+ 3,4 13 I Channel 1, positive power-supply input VS2+ 9.10 9 I Channel 2, positive power-supply input (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Staying below this ± supply turn-on edge rate ensures that the edge-triggered ESD absorption device across the supply pins remains off. (3) Long-term continuous current for electro-migration limits. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply voltage, (VS+) – (VS–) 5.5 V Supply turn-on, turn-off maximum dV/dT(2) 1 V/µs Input/output voltage range (VS–) – 0.5 (VS+) + 0.5 V Differential input voltage ±1 V Current Continuous input current ±10 mA Continuous output current(3) ±20 Continuous power dissipation See the Thermal Information and Thermal Analysis sections Temperature Maximum junction 150 °C Operating free-air, TA –40 125 Storage, Tstg –65 150 |
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