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ADS8691IPW bảng dữ liệu(PDF) 4 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  18-Bit, High-Speed, Single-Supply, SAR ADC Data Acquisition System with Programmable, Bipolar Input Ranges
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ADS8691IPW bảng dữ liệu(HTML) 4 Page - Texas Instruments

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ADS8691, ADS8695, ADS8699
SBAS777 – DECEMBER 2016
www.ti.com
Product Folder Links: ADS8691 ADS8695 ADS8699
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
AVDD = 5 V offers a low impedance of < 30 kΩ.
(3)
AVDD = floating with an impedance > 30 kΩ.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
AIN_P, AIN_GND to GND
AVDD = 5 V(2)
–20
20
V
AVDD = floating(3)
–11
11
AVDD to GND or DVDD to GND
–0.3
7
V
REFCAP to REFGND or REFIO to REFGND
–0.3
5.7
V
GND to REFGND
–0.3
0.3
V
Digital input pins to GND
–0.3
DVDD + 0.3
V
Digital output pins to GND
–0.3
DVDD + 0.3
V
Temperature
Operating, TA
–40
125
°C
Storage, Tstg
–65
150
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Analog input pins
(AIN_P, AIN_GND)
±4000
V
All other pins
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
AVDD
Analog supply voltage
4.75
5
5.25
V
DVDD
Digital supply voltage
1.65
3.3
AVDD
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
ADS8691, ADS8695, ADS8699
UNIT
PW (TSSOP)
RUM (WQFN)
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
95.7
31.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
29.3
27.9
°C/W
RθJB
Junction-to-board thermal resistance
41.5
7.4
°C/W
ψJT
Junction-to-top characterization parameter
1.5
0.3
°C/W
ψJB
Junction-to-board characterization parameter
40.8
7.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
1.9
°C/W


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