ADS8661IRUMT datasheet(4/71 Pages) TI1

tên linh kiện	ADS8661IRUMT

Giải thích chi tiết về linh kiện	12-Bit, High-Speed, Single-Supply, SAR ADC Data Acquisition System with Programmable, Bipolar Input Ranges

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ADS8661, ADS8665

SBAS780 – DECEMBER 2016

www.ti.com

Product Folder Links: ADS8661 ADS8665

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

AVDD = 5 V offers a low impedance of < 30 kΩ.

(3)

AVDD = floating with an impedance > 30 kΩ.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

AIN_P, AIN_GND to GND

AVDD = 5 V(2)

–20

20

V

AVDD = floating(3)

–11

11

AVDD to GND or DVDD to GND

–0.3

7

V

REFCAP to REFGND or REFIO to REFGND

–0.3

5.7

V

GND to REFGND

–0.3

0.3

V

Digital input pins to GND

–0.3

DVDD + 0.3

V

Digital output pins to GND

–0.3

DVDD + 0.3

V

Temperature

Operating, TA

–40

125

°C

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

Analog input pins

(AIN_P, AIN_GND)

±4000

V

All other pins

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Analog supply voltage

4.75

5

5.25

V

DVDD

Digital supply voltage

1.65

3.3

AVDD

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

ADS8661, ADS8665

UNIT

PW (TSSOP)

RUM (WQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

95.7

31.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

29.3

27.9

°C/W

RθJB

Junction-to-board thermal resistance

41.5

7.4

°C/W

ψJT

Junction-to-top characterization parameter

1.5

0.3

°C/W

ψJB

Junction-to-board characterization parameter

40.8

7.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

1.9

°C/W

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