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MC74VHC1G01 bảng dữ liệu(PDF) 6 Page - ON Semiconductor

tên linh kiện MC74VHC1G01
Giải thích chi tiết về linh kiện  Single 2-Input NAND Gate with Open Drain Output
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Trang chủ  http://www.onsemi.com
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MC74VHC1G01 bảng dữ liệu(HTML) 6 Page - ON Semiconductor

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MC74VHC1G01
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6
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE M
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
B
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
M
0
10
S
2.50
3.00
12
3
54
S
A
G
B
D
H
C
J
__
0.20
5X
C AB
T
0.10
2X
2X
T
0.20
NOTE 5
C
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35
1.65
2.85
3.15
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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MC74VHC1G01/D
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For additional information, please contact your local
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