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177

M Series Heatsinks

Heatsink with clips for TO-264 and TO-247

Thermal

Surface Area

Weight Resistance

Part No.

(oz./g)

(°c/w)*

MV-102-55E 45 / 29,097

2.2 / 63

6.0

MA-102-55E 45 / 29,097

2.2 / 63

5.2

MV-101-27E 22 / 14,284

1.1 / 31

9.6

MA-101-27E 22 / 14,284

1.1 / 31

8.0

MV-302-55E 76 / 49,218 4.7 / 134

3.6

MA-302-55E 76 / 49,218 4.7 / 134

3.0

MV-301-27E 37.3 / 24,161 2.3 / 66

5.5

MA-301-27E 37.3 / 24,161 2.3 / 66

4.6

* R-thetac-a for 18W dissipation total for two devices in natural convection

Fea ture S

•Minimumassemblycostandlabor.SpringClips

makethemountingholesandfastenersobsoletein

assemblyoperations&reducecosts.

•MaximumThermalTransfer.Maximumsurfacearea

perunitvolume,efficientcoolingfins&consistent

mountingforcereducesthermalresistance

•MaximumRepeatability.Constantspringforceover

repeatedassembly/disassembly

•MaximumReliability.Resilientspringactionlocks

electroniccomponentinplace.Fewerpartsin

assemblyandnofastenersandwashersrequired.

Preventshortcircuitbyeliminatingmetalparticles

generatedfromhardwareorthreadtapping

•DesignFlexibility.Maximumflexibilityfordynamic

devicelocationsandpowerupgrading.“Configure-

to-Fit”&“Scale-to-Meet”optionsgivedesignersthe

totalfreedomtoconfiguretheheatsinktofittheir

packagingdesignsandtoscaletheheatsinkto

meettheirpowerdissipations.

C H ara C teri S ti CS

Heat Sink Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized

finish.

Spring Clip Music Wire, Per ASTM A228 with bright nickel plating

Solder Foot Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS com-

pliant.

Interface thermal resistance Thermal joint compound or 0.005 Grafoil (TGon 800 by Laird)

Interface electrical isolation Sil-Pad 900S by Bergquist or equivalent

S erie S S pe C i F i C ation S

OhmiteintroducestheMseries,patented(Pat.No.

7,151,669),highperformance,lowcost,configu-

rable,scalableandcompactheatsinkwithmatrixclip

systemforTO-247andTO-264packages.Thispow-

erfulheatsinkprovidestheeasiestassembly,largest

surfaceareaandsmallestfootprint.Itistheideal

typeofheatsinkforhighpowerdensityandsmall

size(1Uor2U)electronicpackagingwithforcedcon-

vectioncooling.

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