STM32F756BG datasheet(8/228 Pages) STMICROELECTRONICS

tên linh kiện	STM32F756BG

Giải thích chi tiết về linh kiện	ARM-based Cortex-M7 32b MCUFPU, 462DMIPS, up to 1MB Flash/32016 4KB RAM, crypto, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD

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8 / 228 page

List of tables

STM32F756xx

8/228

DocID027589 Rev 4

Table 94.

Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 176

Table 95.

Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 177

Table 96.

Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

Table 97.

Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

Table 98.

Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 182

Table 99.

Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Table 100. Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 101. Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 102. SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 103. LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 104. SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Table 105. LPSDR SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Table 106. Quad-SPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Table 107. Quad-SPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

Table 108. DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192

Table 109. LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193

Table 110. Dynamic characteristics: SD / MMC characteristics, VDD=2.7V to 3.6V . . . . . . . . . . . . . 196

Table 111. Dynamic characteristics: eMMC characteristics, VDD=1.71V to 1.9V . . . . . . . . . . . . . . . 196

Table 112. LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data. . . . . . . . 198

Table 113. TFBGA100, 8 x 8 × 0.8 mm thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 202

Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203

Table 116. WLCSP143 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Table 117. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206

Table 118. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

Table 119. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213

Table 120. UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

Table 121. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . . 218

Table 122. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

Table 123. TFBGA216 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 221

Table 124. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223

Table 125. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224

Table 126. Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . 225

Table 127. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226

Số phần tương tự - STM32F756BG

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
STMicroelectronics	STM32F756BG	3Mb / 228P	Up to 25 communication interfaces

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nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
STMicroelectronics	STM32F745XX	3Mb / 227P	ARM-based Cortex-M7 32b MCUFPU, 462DMIPS, up to 1MB Flash/32016 4KB RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD
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	STM32F722XX	4Mb / 224P	Arm짰 Cortex짰-M7 32b MCUFPU, 462DMIPS, up to 512KB Flash 256164KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF February 2022
	STM32F732XX	4Mb / 226P	Arm짰 Cortex짰-M7 32b MCUFPU, 462DMIPS, up to 512KB Flash 256164KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF February 2022
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	STM32F405RGT6	2Mb / 180P	ARM Cortex-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
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	STM32F405XX	5Mb / 201P	ARM Cortex-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera October 2015
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