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STM32F756VG bảng dữ liệu(PDF) 5 Page - STMicroelectronics

tên linh kiện STM32F756VG
Giải thích chi tiết về linh kiện  ARM-based Cortex-M7 32b MCUFPU, 462DMIPS, up to 1MB Flash/32016 4KB RAM, crypto, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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STM32F756VG bảng dữ liệu(HTML) 5 Page - STMicroelectronics

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STM32F756xx
Contents
5
5.3.28
Quad-SPI interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
5.3.29
Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 192
5.3.30
LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 193
5.3.31
SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 195
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
6.1
LQFP100, 14 x 14 mm low-profile quad flat package information . . . . . 197
6.2
TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
6.3
WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip
scale package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
6.4
LQFP144, 20 x 20 mm low-profile quad flat package information . . . . . 206
6.5
LQFP176, 24 x 24 mm low-profile quad flat package information . . . . . 209
6.6
LQFP208, 28 x 28 mm low-profile quad flat package information . . . . . 213
6.7
UFBGA 176+25, 10 x 10 x 0.65 mm ultra thin-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
6.8
TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
6.9
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
7
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 225
A.1
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226


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