MC74HCT245A

http://onsemi.com

6

ORDERING INFORMATION

Device

Package

MC74HCT245ANG

PDIP−20

(Pb−Free)

18 Units / Rail

MC74HCT245ADWG

SOIC−20

(Pb−Free)

38 Units / Rail

MC74HCT245ADWR2G

SOIC−20

(Pb−Free)

1000 / Tape & Reel

MC74HCT245ADTG

TSSOP−20*

75 Units / Rail

MC74HCT245ADTR2G

TSSOP−20*

2500 / Tape & Reel

MC74HCT245AFELG

SOEIAJ−20

(Pb−Free)

2000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*These packages are inherently Pb−Free.

MARKING DIAGRAMS

PDIP−20

SOIC−20W

TSSOP−20

SOEIAJ−20

20

1

74HCT245A

AWLYWWG

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

G or G

= Pb−Free Package

(Note: Microdot may be in either location)

1

20

HCT

245A

ALYWG

G

20

1

HCT245A

AWLYYWWG

1

20

MC74HCT245AN

AWLYYWWG