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MC100LVEL11DTG bảng dữ liệu(PDF) 4 Page - ON Semiconductor

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Giải thích chi tiết về linh kiện  ECL 1:2 Differential Fanout Buffer
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Table 6. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 9)
−40
°C
25
°C
95
°C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
fmax
Maximum Toggle Frequency
1.0
GHz
tPLH
tPHL
Propagation Delay to Output
235
385
255
330
405
285
435
ps
tSKEW
Within-Device Skew (Note 10)
Device−to−Device (Note 11)
Duty Cycle Skew (Note 12)
5
10
20
150
20
5
10
20
150
20
5
10
20
150
20
ps
tJITTER
Random Clock Jitter (RMS)
0.6
ps
VPP
Input Swing (Note 13)
200
1000
200
1000
200
1000
mV
tr
tf
Output Rise/Fall Times Q
(20% − 80%)
120
320
120
220
320
120
320
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
9.
VEE can vary ±0.3 V.
10. Within-device skew defined as identical transitions on similar paths through a device.
11. Device−to−device skew for identical transitions at identical VCC levels.
12. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
13. VPP(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV,
however, AC delays may move outside of the specified range. The device has a DC gain of
≈40.
Figure 2. Output Swing versus Frequency
0
200
400
600
800
0
200
400
600
800
1000
1200
1400
1600
1800
2000
f (MHz)


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