MC10EP56, MC100EP56

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3

Table 3. ATTRIBUTES

Characteristics

Value

Value

Internal Input Pulldown Resistor

75 k

W

Internal Input Pullup Resistor

N/A

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 2 kV

> 150 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Pb Pkg

Pb−Free Pkg

SOIC

TSSOP

QFN

Level 1

Level 1

N/A

Level 3

Level 3

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

140 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

PECL Mode Power Supply

6

V

NECL Mode Power Supply

−6

V

PECL Mode Input Voltage

NECL Mode Input Voltage

6

−6

V

V

Output Current

Continuous

Surge

50

100

mA

mA

± 0.5

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

20 TSSOP

20 TSSOP

140

100

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

20 TSSOP

23 to 41

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

20 SOIC

20 SOIC

90

60

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

20 SOIC

33 to 35

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

QFN−20

QFN−20

47

33

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

QFN−20

18

°C/W

Wave Solder

Pb

Pb−Free

<2 to 3 sec @ 248

°C

<2 to 3 sec @ 260

°C

265

265

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.