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LM137HPQMLV bảng dữ liệu(PDF) 5 Page - National Semiconductor (TI) |
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LM137HPQMLV bảng dữ liệu(HTML) 5 Page - National Semiconductor (TI) |
5 / 12 page Connection Diagrams (Continued) TO-220 Plastic Package 3-Lead SOT-223 00906707 Front View Order Number LM337T See NS Package Number T03B 00906734 Front View Order Number LM337IMP Package Marked N02A See NS Package Number MP04A Application Hints When a value for θ (H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. HEATSINKING SOT-223 PACKAGE PARTS The SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figures 3, 4 show the information for the SOT-223 package. Figure 4 assumes a θ (J−A) of 75˚C/W for 1 ounce copper and 51˚C/W for 2 ounce copper and a maximum junction tem- perature of 125˚C. Please see AN1028 for power enhancement techniques to be used with the SOT-223 package. 00906732 FIGURE 3. θ (J−A) vs Copper (2 ounce) Area for the SOT-223 Package 00906733 FIGURE 4. Maximum Power Dissipation vs. T AMB for the SOT-223 Package www.national.com 5 |
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