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FDC37N769 bảng dữ liệu(PDF) 11 Page - Agilent(Hewlett-Packard) |
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FDC37N769 bảng dữ liệu(HTML) 11 Page - Agilent(Hewlett-Packard) |
11 / 25 page 10 Moisture Proof Packaging All HSDL-3602 options are shipped in moisture proof package. Once opened, moisture absorption begins. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In reels 60 °C ≥ 48 hours In bulk 100 °C ≥ 4 hours 125 °C ≥ 2 hours 150 °C ≥ 1 hour Baking should be done only once. Recommended Storage Conditions Storage 10 °C to 30°C Temperature Relative below 60% RH Humidity Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within 3 days if stored at the recom- mended storage conditions. If times longer than 72 hours are needed, the parts must be stored in a dry box. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH PACKAGE IS OPENED LESS THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO NO YES |
Số phần tương tự - FDC37N769 |
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Mô tả tương tự - FDC37N769 |
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