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MC33363B bảng dữ liệu(PDF) 11 Page - ON Semiconductor

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11
PACKAGE DIMENSIONS
SO−16WB
DW SUFFIX
CASE 751N
ISSUE O
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
10.15
10.45
0.400
0.411
B
7.40
7.60
0.292
0.299
C
2.35
2.65
0.093
0.104
D
0.35
0.49
0.014
0.019
F
0.50
0.90
0.020
0.035
G
1.27 BSC
0.050 BSC
J
0.25
0.32
0.010
0.012
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
10.05
10.55
0.395
0.415
R
0.25
0.75
0.010
0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
−A−
−B−
P
G
9X
D
13X
SEATING
PLANE
−T−
S
A
M
0.010 (0.25)
B S
T
16
9
8
1
F
J
R X 45_
__
_
_
M
T
S
S
2.54 BSC
0.100 BSC
T
3.81 BSC
0.150 BSC
C
K
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Phone: 421 33 790 2910
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MC33363B/D
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