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MC33288DH Datasheet(PDF) 7 Page - Motorola, Inc

tên linh kiện MC33288DH
Nội dung chi tiết  Solid State Relay for Automotive Flasher Applications
tải về  8 Pages
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nhà sản xuất  MOTOROLA [Motorola, Inc]
Trang chủ  http://www.freescale.com
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MC33288
Solid State Relay for Automotive Flasher Applications
7
Soldering Information
This device is packaged in a Surface Mount Power
package indended to be soldered directly on the Printed
Circuit Board.
This device was qualified according to JEDEC standards
JESD22-A113-B and J-STD-020A with the reflow conditions
applicable for packages with thickness above 2.5mm :
Convection 220°C +5/-0°C
VPR 215-219°C
IR / Convection 220°C +5/-0°C
The maximum peak temperature during the soldering process
should not exceed 220°C (+5°C/-0°C). The time at maximum
temperature should range from 10 to 40s max.
Thermal Management
The junction to case thermal resistance is 2
°C/W
maximum. The junction to ambient thermal resistance is
dependent on the mounting technology and the addition of
heat sink. One of the most commonly used mounting
technique consists in using the printed circuit board and the
copper lines as heat sink.
Figure 1. Printed Board Layout Example (not to scale)
Figure 1 shows an example of printed circuit board layout.
It has a total of 10cm2 additional copper on two sides (2.5 cm2
on the top side and 7.5 cm2 on the down side).
With the above layout, thermal resistance junction to ambient
of 25
°C/W can be achieved, this value being splitted into :
• junction to case : Rthjc1 = Rthjc2 = 2
°C/W
• case to ambient : Rthca = 23
°C/W.
Lower value can be reached with the help of larger and
thicker copper metal, higher number of thermal via from top to
down side pcb and the use of additional thermal via from the
circuit board to the module case.
Steady State Thermal Model
The junction to ambient thermal resistance of the circuit
mounted on a printed circuit board can be splitted into two
main parts : junction to case and case to ambient resistances.
A simplified steady state model is shown in figure 2.
Figure 2. Simplified Thermal Model (Electrical Equivalent)
Transient Thermal Model
A more complete model including thermal capacitance is
proposed in figure 3.
Figure 3. Transient thermal model
This gives a thermal impedance versus time (figure 4), which
has been determined with the printed circuit board shown in
figure 1.
Figure 4. Junction to ambiant Thermal impedance
This figure shows that the steady state is reached after about
10 minutes. It also clearly shows that the device can dissipate
almost twice the power within one minute compared to the
maximum allowed power dissipation in steady state.
Down side pcb
Top side pcb
2 cm2
8 cm2
HSOP20
external pcb (4x4 cm)
Thermal
via from
top to down
side pcb
Rthca
Rthjc2
Rthjc1
Chan 1 Junction
Ambient Temp Node
Chan 2
Case Temp Node
Chan 2 Junction
Temp Node
Temp Node
Chan 1
Switch
Chan 2
Switch
Power (W)
Chan 1
Power (W)
(1.0A=1W of
(1.0V=1
°C)
(Volts represent Die
Surface Temperature)
(1.0
Ω=1°C/W)
Power Dissipation)
2°C/W
2°C/W
25°C/W
AmbientTemperature
MOS1
MOS2
Control
Case
Board
Ambiant
3K/W
3K/W
3K/W
450K/W
3K/W
20K/W
6J/K
0.5J/K
4mJ/K
5mJ/K
5mJ/K
1mJ/K
3.5K/W
3.5K/W
300K/W
MOS3
30
20
10
0
0
100
200
300
400
500
600
700
800
Time (sec.)
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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