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MCP2022T-500E/ST bảng dữ liệu(PDF) 5 Page - Microchip Technology |
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MCP2022T-500E/ST bảng dữ liệu(HTML) 5 Page - Microchip Technology |
5 / 54 page 2005-2014 Microchip Technology Inc. DS20002018H-page 5 MCP2021/2/1P/2P 1.0 DEVICE OVERVIEW The MCP2021/2/1P/2P provides a physical interface between a microcontroller and a LIN half-duplex bus. It is intended for automotive and industrial applications with serial bus speeds up to 20 Kbaud. The MCP2021/2/1P/2P provides a half-duplex, bidirectional communications interface between a microcontroller and the serial network bus. This device will translate the CMOS/TTL logic levels to LIN-level logic, and vice versa. The LIN specification 2.0 requires that the transceiver(s) of all nodes in the system be connected via the LIN pin, referenced to ground, and with a maximum external termination resistance load of 510Ω from LIN bus to battery supply. The 510Ω corresponds to one Master and sixteen Slave nodes. The MCP2021/2/1P/2P-500 provides a +5V, 50 mA, regulated power output. The regulator uses an LDO design, is short-circuit protected, and will turn the regulator output off if it falls below 3.5V. The MCP2021/2/1P/2P also includes thermal-shutdown protection. The regulator is specifically designed to operate in the automotive environment and will survive +43V load dump transients, double-battery jumps, and reverse battery connections when a reverse blocking diode is used. The other members of the MCP2021/2/1P/2P-330 family output +3.3V at 50 mA with a turn-off voltage of 2.5V. (See Section 1.6 “Internal Voltage Regulator” ). MCP2021/2 wakes from Power-Down mode on a dominant level on LBUS. MCP2021P/2P wakes at a transition from recessive level to dominant level on LBUS. 1.1 Optional External Protection 1.1.1 REVERSE BATTERY PROTECTION An external reverse-battery-blocking diode should be used to provide polarity protection (see Figure 1-6). 1.1.2 TRANSIENT VOLTAGE PROTECTION (LOAD DUMP) An external 43V transient suppressor (TVS) diode, between VBB and ground, with a 50Ω transient protec- tion resistor (RTP) in series with the battery supply and the VBB pin, protect the device from power transients (see Figure 1-6) and ESD events. While this protection is optional, it is considered good engineering practice. The resistor value is chosen according to Equation 1-1. EQUATION 1-1: 1.2 Internal Protection 1.2.1 ESD PROTECTION For component-level ESD ratings, please refer to the Section 2.1 “Absolute Maximum Ratings†” . 1.2.2 GROUND LOSS PROTECTION The LIN Bus specification states that the LIN pin must transition to the recessive state when ground is disconnected. Therefore, a loss of ground effectively forces the LIN line to a high-impedance level. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die tem- perature and is able to shut down the LIN transmitter and voltage regulator if it detects a thermal overload. There are three causes for a thermal overload. A thermal shut down can be triggered by any one, or a combination of, the following thermal overload conditions: • Voltage regulator overload • LIN bus output overload • Increase in die temperature due to increase in environmental temperature Driving the TXD and checking the RXD pin makes it pos- sible to determine whether there is a bus contention (i.e., RXD = low, TXD = high) or a thermal overload con- dition (i.e., RXD = high, TXD = low). RTP (VBB min - 5.5) / 250 mA. 5.5V = VUVLO + 1.0V, 250 mA is the peak current at Power-On when VBB = 5.5V |
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