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MCP2004T-E/SN bảng dữ liệu(PDF) 3 Page - Microchip Technology |
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MCP2004T-E/SN bảng dữ liệu(HTML) 3 Page - Microchip Technology |
3 / 34 page 2010-2014 Microchip Technology Inc. DS20002230F-page 3 MCP2003/4/3A/4A 1.0 DEVICE OVERVIEW The MCP2003/4/3A/4A devices provide a physical interface between a microcontroller and a LIN bus. These devices will translate the CMOS/TTL logic levels to LIN logic level, and vice versa. It is intended for automotive and industrial applications with serial bus speeds up to 20 kbaud. LIN Bus Specification Revision 2.1 requires that the transceiver of all nodes in the system is connected via the LIN pin, referenced to ground and with a maximum external termination resistance load of 510 from LIN bus to battery supply. The 510 corresponds to 1 master and 15 slave nodes. The VREN pin can be used to drive the logic input of an external voltage regulator. This pin is high in all modes except for Power-Down mode. 1.1 External Protection 1.1.1 REVERSE BATTERY PROTECTION An external reverse-battery-blocking diode should be used to provide polarity protection (see Example 1-1). 1.1.2 TRANSIENT VOLTAGE PROTECTION (LOAD DUMP) An external 43V transient suppressor (TVS) diode, between VBB and ground, with a 50 transient protection resistor (RTP) in series with the battery supply and the VBB pin serve to protect the device from power transients (see Example 1-1) and ESD events. While this protection is optional, it is considered good engineering practice. 1.2 Internal Protection 1.2.1 ESD PROTECTION For component-level ESD ratings, please refer to the maximum operation specifications. 1.2.2 GROUND LOSS PROTECTION The LIN Bus specification states that the LIN pin must transition to the recessive state when ground is disconnected. Therefore, a loss of ground effectively forces the LIN line to a high-impedance level. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter. There are two causes for a thermal overload. A thermal shutdown can be triggered by either, or both, of the following thermal overload conditions. • LIN bus output overload • Increase in die temperature due to increase in environment temperature Driving the TXD and checking the RXD pin makes it possible to determine whether there is a bus contention (Rx = low, Tx = high) or a thermal overload condition (Rx = high, Tx = low). After a thermal overload event, the device will automatically recover once the die temperature has fallen below the recovery temperature threshold (see Figure 1-1). FIGURE 1-1: THERMAL SHUTDOWN STATE DIAGRAM Operation Mode Transmitter Shutdown LIN bus Shorted to VBB Temp < ShutdownTEMP |
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