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MCP2021-500E/ST bảng dữ liệu(PDF) 5 Page - Microchip Technology

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 2005-2014 Microchip Technology Inc.
DS20002018H-page 5
MCP2021/2/1P/2P
1.0
DEVICE OVERVIEW
The MCP2021/2/1P/2P provides a physical interface
between a microcontroller and a LIN half-duplex bus. It
is intended for automotive and industrial applications
with serial bus speeds up to 20 Kbaud.
The
MCP2021/2/1P/2P
provides
a
half-duplex,
bidirectional communications interface between a
microcontroller and the serial network bus. This device
will translate the CMOS/TTL logic levels to LIN-level
logic, and vice versa.
The
LIN
specification
2.0
requires
that
the
transceiver(s) of all nodes in the system be connected
via the LIN pin, referenced to ground, and with a
maximum external termination resistance load of 510Ω
from LIN bus to battery supply. The 510Ω
corresponds
to one Master and sixteen Slave nodes.
The MCP2021/2/1P/2P-500 provides a +5V, 50 mA,
regulated power output. The regulator uses an LDO
design, is short-circuit protected, and will turn the
regulator output off if it falls below 3.5V.
The
MCP2021/2/1P/2P
also
includes
thermal-shutdown protection.
The regulator is specifically designed to operate in the
automotive environment and will survive +43V load
dump transients, double-battery jumps, and reverse
battery connections when a reverse blocking diode is
used.
The
other
members
of
the
MCP2021/2/1P/2P-330 family output +3.3V at 50 mA
with a turn-off voltage of 2.5V. (See Section 1.6
“Internal Voltage Regulator”
).
MCP2021/2 wakes from Power-Down mode on a
dominant level on LBUS. MCP2021P/2P wakes at a
transition from recessive level to dominant level on
LBUS.
1.1
Optional External Protection
1.1.1
REVERSE BATTERY PROTECTION
An external reverse-battery-blocking diode should be
used to provide polarity protection (see Figure 1-6).
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
An external 43V transient suppressor (TVS) diode,
between VBB and ground, with a 50Ω transient protec-
tion resistor (RTP) in series with the battery supply and
the VBB pin, protect the device from power transients
(see Figure 1-6) and ESD events. While this protection
is optional, it is considered good engineering practice.
The resistor value is chosen according to Equation 1-1.
EQUATION 1-1:
1.2
Internal Protection
1.2.1
ESD PROTECTION
For component-level ESD ratings, please refer to the
Section 2.1 “Absolute Maximum Ratings†”
.
1.2.2
GROUND LOSS PROTECTION
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a high-impedance level.
1.2.3
THERMAL PROTECTION
The thermal protection circuit monitors the die tem-
perature and is able to shut down the LIN transmitter
and voltage regulator if it detects a thermal overload.
There are three causes for a thermal overload. A
thermal shut down can be triggered by any one, or a
combination of, the following thermal overload
conditions:
• Voltage regulator overload
• LIN bus output overload
• Increase in die temperature due to increase in
environmental temperature
Driving the TXD and checking the RXD pin makes it pos-
sible to determine whether there is a bus contention
(i.e., RXD = low, TXD = high) or a thermal overload con-
dition (i.e., RXD = high, TXD = low).
RTP
(VBB
min - 5.5) / 250 mA.
5.5V = VUVLO + 1.0V,
250 mA is the peak current at Power-On when
VBB = 5.5V


Số phần tương tự - MCP2021-500E/ST

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
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