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MCP2003T-E/MD bảng dữ liệu(PDF) 1 Page - Microchip Technology |
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MCP2003T-E/MD bảng dữ liệu(HTML) 1 Page - Microchip Technology |
1 / 34 page 2010-2014 Microchip Technology Inc. DS20002230F-page 1 MCP2003/4/3A/4A Features: • The MCP2003/2003A and MCP2004/2004A are compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0 and 2.1 and are compliant to SAE J2602 • Support Baud Rates up to 20 kbaud with LIN-Compatible Output Driver • 43V Load Dump Protected • Very Low High Electromagnetic Immunity (EMI) meets Stringent Original Equipment Manufactur- ers (OEM) Requirements • Very High Electrostatic Discharge (ESD) Immunity: ->20 kV on VBB (IEC 61000-4-2) ->14 kV on LBUS (IEC 61000-4-2) • Very High Immunity to RF Disturbances meets Stringent OEM Requirements • Wide Supply Voltage, 6.0V-27.0V Continuous • Extended Temperature Range: -40 to +125°C • Interface to PIC® MCU EUSART and Standard USARTs • LIN Bus Pin: - Internal pull-up resistor and diode - Protected against battery shorts - Protected against loss of ground - High current drive • Automatic Thermal Shutdown • Low-Power mode: - Receiver monitoring bus and transmitter off, ( 5µA) Description: This device provides a bidirectional, half-duplex communication, physical interface to automotive and industrial LIN systems to meet the LIN Bus Specification Revision 2.1 and SAE J2602. The device is short-circuit and over-temperature protected by internal circuitry. The device has been specifically designed to operate in the automotive operating environment and will survive all specified transient conditions while meeting all of the stringent quiescent current requirements. MCP200X family members: • 8-pin PDIP, DFN and SOIC packages: - MCP2003, LIN-compatible driver, with WAKE pins, wake-up on falling edge of LBUS - MCP2003A, LIN-compatible driver, with WAKE pins, wake-up on rising edge of LBUS - MCP2004, LIN-compatible driver, with FAULT/TXE pins, wake-up on falling edge of LBUS - MCP2004A, LIN-compatible driver, with FAULT/TXE pins, wake-up on rising edge of LBUS Package Types MCP2004/2004A PDIP, SOIC FAULT/TXE CS/WAKE TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS VREN RXD MCP2003/2003A PDIP, SOIC WAKE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS VREN RXD MCP2003/2003A 4x4 DFN* WAKE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS VREN RXD EP 9 MCP2004/2004A 4x4 DFN* FAULT/TXE CS/WAKE TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS VREN RXD EP 9 * Includes Exposed Thermal Pad (EP); see Table 1-2. LIN J2602 Transceiver |
Số phần tương tự - MCP2003T-E/MD |
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Mô tả tương tự - MCP2003T-E/MD |
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