công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
MC33291 bảng dữ liệu(PDF) 4 Page - Motorola, Inc |
|
MC33291 bảng dữ liệu(HTML) 4 Page - Motorola, Inc |
4 / 24 page 33291 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 4 MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit Power Supply Voltage Normal Operation (Steady-State) Transient Conditions (Note 1) VPWR(SUS) VPWR(PK) - 1.5 to 26.5 - 13 to 60 V Logic Supply Voltage (Note 2) VDD - 0.3 to 7.0 V Input Pin Voltage (Note 3) VIN - 0.3 to 7.0 V Output Clamp Voltage (Note 4) 5.0 mA ≤ Iout ≤ 0.5 A VOUT(OFF) 45 to 65 V Output Self-Limit Current IOUT(LIM) 1.0 to 3.0 A Continuous Per Output Current (Note 5) IOUT(CONT) 500 mA ESD Voltage (Note 6) Human Body Model (Note 7) Machine Model (Note 8) VESD1 VESD2 2000 200 V Output Clamp Energy (Note 9) ECLAMP 50 mJ Recommended Frequency of SPI Operation fSPI 3.0 MHz Storage Temperature TSTG - 55 to 150 °C Operating Case Temperature TC - 40 to 125 °C Operating Junction Temperature TJ - 40 to 150 °C Power Dissipation ( TA = 25° C) (Note 10) PD 2.0 W Soldering Temperature (Note 11) TSOLDER 260 °C Thermal Resistance (Junction-to-Ambient) Case 751E-04 Package All Outputs ON (Note 12) Single Output ON (Note 13) RθJA 45 60 °C/W Notes: 1. Transient capability with external 100 Ω resistor in series with VP pin and supply. 2. Exceeding these limits may cause a malfunction or permanent damage to the device. 3. Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device. 4. With output OFF. 5. Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125 °C ambient temperature will require maximum output current computation using package RθJA. 6. ESD data available upon request. 7. ESD1 testing is performed in accordance with the Human Body Model (CZap = 200 pF, RZap = 1500 Ω). 8. ESD2 testing is performed in accordance with the Machine Model (CZap = 200pF, RZap = 0 Ω). 9. Maximum output clamp energy capability at 150 °C junction temperature using a single non-repetitive pulse method. 10. Maximum power dissipation at indicated junction temperature with no heat sink used. 11. Lead soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering; exceeding these limits may cause malfunction or permanent damage to the device.Contact Motorola Sales Office for device immersion soldering time/temperature limits. 12. Thermal resistance from Junction-to-Ambient with all outputs ON and dissipating equal power. 13. Thermal resistance from Junction -to-Ambient with a single output ON. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
Số phần tương tự - MC33291 |
|
Mô tả tương tự - MC33291 |
|
|
Link URL |
Chính sách bảo mật |
ALLDATASHEET.VN |
Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |