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LMZ31530RLGT bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LMZ31530RLGT bảng dữ liệu(HTML) 3 Page - Texas Instruments |
3 / 30 page LMZ31530 www.ti.com SLVSBC7B – OCTOBER 2013 – REVISED DECEMBER 2013 THERMAL INFORMATION LMZ31530 THERMAL METRIC(1) RLG UNIT 72 PINS θJA Junction-to-ambient thermal resistance(2) Natural Convection 8.6 θJA(100LFM) Junction-to-ambient thermal resistance(3) 100 LFM 7.8 °C/W ψJT Junction-to-top characterization parameter(4) 1.6 ψJB Junction-to-board characterization parameter(5) 4.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA. (3) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and 100 LFM forced air cooling. Additional airflow reduces θJA. (4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. (5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. PACKAGE SPECIFICATIONS LMZ31530 UNIT Weight 4.96 grams Flammability Meets UL 94 V-O MTBF Calculated reliability Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign 26.5 MHrs Copyright © 2013, Texas Instruments Incorporated 3 Product Folder Links: LMZ31530 |
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