TL16C552

DUAL ASYCHRONOUS COMMUNICATIONS ELEMENT

WITH FIFO

SLLS102B − DECEMBER 1990 − REVISED MARCH 1996

6

POST OFFICE BOX 655303

POST OFFICE BOX 1443

electrical characteristics over recommended ranges of operating free-air temperature and supply

voltage

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

VOH

High-level output voltage

IOH = − 0.4 mA for DB0 −DB7,

IOH = − 2 mA for PD0 −PD7,

IOH = − 0.4 mA for INIT, AFD, STB, and SLIN (see Note 2),

IOH = − 0.4 mA for all other outputs

2.4

V

VOL

Low-level output voltage

IOL = 4 mA for DB0 −DB7,

IOL = 12 mA for PD0 −PD7,

IOL = 10 mA for INIT, AFD, STB, and SLIN (see Note 2),

IOL = 2 mA for all other outputs

0.4

V

II

Input current

VDD = 5.25 V,

All other terminals are floating

±10

µA

II(CLK)

Clock input current

VI = 0 to 5.25 V

±10

µA

VDD = 5.25 V,

VO = 0 with chip deselected, or

IOZ

High-impedance output current

VDD = 5.25 V,

VO = 0 with chip deselected, or

VO = 5.25 V with chip and write mode selected

±20

µA

IOZ

High-impedance output current

DD

O

VO = 5.25 V with chip and write mode selected

±20

µA

VDD = 5.25 V,

No loads on outputs,

IDD

Supply current

VDD = 5.25 V,

No loads on outputs,

SIN0, SIN1, DSR0, DSR1, DCD0, DCD1, CTS0, CTS1,

50

mA

IDD

Supply current

SIN0, SIN1, DSR0, DSR1, DCD0, DCD1, CTS0, CTS1,

RI0 and RI1 at 2 V,

Other inputs at 0.8 V,

50

mA

RI0 and RI1 at 2 V,

Other inputs at 0.8 V,

Baud rate generator fclock = 8 MHz,

Baud rate = 56 kbit/s

NOTE 2: These four terminals contain an internal pullup resistor to VDD of approximately 10 kΩ.

clock timing requirements over recommended ranges of operating free-air temperature and supply

voltage

MIN

MAX

UNIT

tw1

Pulse duration, CLK high (external clock, 8 MHz max) (see Figure 1)

55

ns

tw2

Pulse duration, CLK low (external clock, 8 MHz max) (see Figure 1)

55

ns

tw3

Pulse duration, master (RESET) low (see Figure 16)

1000

ns

read cycle timing requirements over recommended ranges of operating free-air temperature and

supply voltage (see Figure 4)

MIN

MAX

UNIT

tw4

Pulse duration, IOR low

80

ns

tsu1

Setup time, chip select valid before IOR low (see Note 3)

15

ns

tsu2

Setup time, A2 − A0 valid before IOR low (see Note 3)

15

ns

th1

Hold time, A2 − A0 valid after IOR high (see Note 3)

20

ns

th2

Hold time, chip select valid after IOR high (see Note 3)

20

ns

td1

Delay time, tsu2 + tw4 + td2 (see Note 4)

175

ns

td2

Delay time, IOR high to IOR or IOW low

80

ns

NOTES:

3. The internal address strobe is always active.

4. In the FIFO mode, td1 = 425 ns (min) between reads of the receiver FIFO and the status registers (IIR and LSR).