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LMH3401 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LMH3401 bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 50 page LMH3401 SBOS695A – AUGUST 2014 – REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply 5.5 V Voltage Input voltage range VS– – 0.7 VS+ + 0.7 V Input current, IN+, IN– 10 mA Current Output current (sourcing or sinking) OUT+, OUT– 100 mA Continuous power dissipation See Thermal Information Maximum junction temperature, TJ 150 °C Maximum junction temperature, continuous operation, long-term Temperature 125 °C reliability Operating free-air, TA –40 85 °C Storage, Tstg –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (VS = VS+ – VS–) 3.15 5 5.25 V Operating junction temperature, TJ –40 125 °C Ambient operating air temperature, TA –40 25 85 °C 7.4 Thermal Information LMH3401 THERMAL METRIC(1) RMS (UQFN) UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 101 RθJC(top) Junction-to-case (top) thermal resistance 51 RθJB Junction-to-board thermal resistance 61 °C/W ψJT Junction-to-top characterization parameter 4.2 ψJB Junction-to-board characterization parameter 61 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LMH3401 |
Số phần tương tự - LMH3401_16 |
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Mô tả tương tự - LMH3401_16 |
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