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LMH3401 bảng dữ liệu(PDF) 4 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  LMH3401 7-GHz, Ultra-Wideband, Fixed-Gain, Fully-Differential Amplifier
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LMH3401
SBOS695A – AUGUST 2014 – REVISED DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Power supply
5.5
V
Voltage
Input voltage range
VS– – 0.7
VS+ + 0.7
V
Input current, IN+, IN–
10
mA
Current
Output current (sourcing or sinking) OUT+, OUT–
100
mA
Continuous power dissipation
See Thermal Information
Maximum junction temperature, TJ
150
°C
Maximum junction temperature, continuous operation, long-term
Temperature
125
°C
reliability
Operating free-air, TA
–40
85
°C
Storage, Tstg
–40
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
Electrostatic
V(ESD)
V
discharge
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage (VS = VS+ – VS–)
3.15
5
5.25
V
Operating junction temperature, TJ
–40
125
°C
Ambient operating air temperature, TA
–40
25
85
°C
7.4 Thermal Information
LMH3401
THERMAL METRIC(1)
RMS (UQFN)
UNIT
14 PINS
RθJA
Junction-to-ambient thermal resistance
101
RθJC(top)
Junction-to-case (top) thermal resistance
51
RθJB
Junction-to-board thermal resistance
61
°C/W
ψJT
Junction-to-top characterization parameter
4.2
ψJB
Junction-to-board characterization parameter
61
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: LMH3401


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