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LM7301IM5X bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LM7301IM5X bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 LM7301 SNOS879I – AUGUST 1999 – REVISED MAY 2016 www.ti.com Product Folder Links: LM7301 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Applies to both single-supply and split-supply operation. Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Differential input voltage 15 V Voltage at input and output pin (V+) + 0.3 (V–) – 0.3 V Supply voltage (V+ − V−) 35 V Current at input pin ±10 mA Current at output pin(3) ±20 mA Current at power supply pin 25 mA Junction temperature, TJ (4) 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT Supply voltage 1.8 32 V Operating temperature (2) –40 85 °C Package thermal resistance (RθJA) (2) 5-pin SOT-23 325 325 °C/W 8-pin SOIC 165 165 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM7301 UNIT DBV (SOT-23) D (SOIC) 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 169 120 °C/W RθJC(top) Junction-to-case (top) thermal resistance 122 65 °C/W RθJB Junction-to-board thermal resistance 30 61 °C/W ψJT Junction-to-top characterization parameter 17 16 °C/W ψJB Junction-to-board characterization parameter 29 60 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W |
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