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Giải thích chi tiết về linh kiện  LM7301 Low Power, 4-MHz GBW, Rail-to-Rail Input-Output Operational Amplifier in SOT-23 Package
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LM7301
SNOS879I – AUGUST 1999 – REVISED MAY 2016
www.ti.com
Product Folder Links: LM7301
Submit Documentation Feedback
Copyright © 1999–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
Applies to both single-supply and split-supply operation. Continuous short-circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Differential input voltage
15
V
Voltage at input and output pin
(V+) + 0.3
(V) – 0.3
V
Supply voltage (V+
− V)
35
V
Current at input pin
±10
mA
Current at output pin(3)
±20
mA
Current at power supply pin
25
mA
Junction temperature, TJ
(4)
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
Supply voltage
1.8
32
V
Operating temperature (2)
–40
85
°C
Package thermal resistance (RθJA)
(2)
5-pin SOT-23
325
325
°C/W
8-pin SOIC
165
165
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
LM7301
UNIT
DBV (SOT-23)
D (SOIC)
5 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
169
120
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
122
65
°C/W
RθJB
Junction-to-board thermal resistance
30
61
°C/W
ψJT
Junction-to-top characterization parameter
17
16
°C/W
ψJB
Junction-to-board characterization parameter
29
60
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W


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