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LM7372IMA bảng dữ liệu(PDF) 3 Page - Texas Instruments

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tên linh kiện LM7372IMA
Giải thích chi tiết về linh kiện  LM7372 High Speed, High Output Current, Dual Operational Amplifier
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nhà sản xuất  TI1 [Texas Instruments]
Trang chủ  http://www.ti.com
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LM7372IMA bảng dữ liệu(HTML) 3 Page - Texas Instruments

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OUT B
1
2
3
4
5
6
7
8
OUT A
-IN A
+IN A
V
-
V
+
-IN B
+IN B
-
+
+
-
A
B
OUT A
1
2
8
+IN A
V-
V+
-IN B
+IN B
+
-
+
-
A
B
7
6
5
4
3
16
15
14
13
12
11
10
9
NC
NC
NC
NC
*
*
*
*
-IN A
OUT B
LM7372
www.ti.com
SNOS926F – MAY 1999 – REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
NOTE
For SO PowerPAD package the exposed pad should be tied either to Vor left electrically
floating. Die attach material is conductive and is internally tied to V.
* Heatsink Pins.(1)
Package DDA
Package D
8-Pin SO PowerPAD
16-Pin SOIC
Top View
Top View
Pin Functions
PIN
NUMBER
I/O
DESCRIPTION
NAME
DDA
D
*
––
1,8,9,16
––
Heatsink Pin
-IN A
2
4
I
ChA Inverting Input
+IN A
3
5
I
ChA Non-inverting Input
-IN B
6
12
I
ChB Inverting Input
+IN B
5
11
I
ChB Non-inverting Input
NC
––
2, 7, 10, 15
––
No Connection
OUT A
1
3
O
Output A
OUT B
7
13
O
Output B
V-
4
6
I
Negative Supply
V+
8
14
I
Positive Supply
(1)
The maximum power dissipation is a function of T(JMAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T(JMAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board. The value for RθJA is
106°C/W for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, RθJA for the 16-Pin SOIC
is decreased to 70°C/W. 8-Pin SO PowerPAD package RθJA is with 2 in
2 heatsink (top and bottom layer each) and 1 oz. copper (see
Table 2 and Application and Implementation )
Copyright © 1999–2014, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM7372


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