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LM7372IMA bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LM7372IMA bảng dữ liệu(HTML) 3 Page - Texas Instruments |
3 / 28 page OUT B 1 2 3 4 5 6 7 8 OUT A -IN A +IN A V - V + -IN B +IN B - + + - A B OUT A 1 2 8 +IN A V- V+ -IN B +IN B + - + - A B 7 6 5 4 3 16 15 14 13 12 11 10 9 NC NC NC NC * * * * -IN A OUT B LM7372 www.ti.com SNOS926F – MAY 1999 – REVISED SEPTEMBER 2014 5 Pin Configuration and Functions NOTE For SO PowerPAD package the exposed pad should be tied either to V− or left electrically floating. Die attach material is conductive and is internally tied to V−. * Heatsink Pins.(1) Package DDA Package D 8-Pin SO PowerPAD 16-Pin SOIC Top View Top View Pin Functions PIN NUMBER I/O DESCRIPTION NAME DDA D * –– 1,8,9,16 –– Heatsink Pin -IN A 2 4 I ChA Inverting Input +IN A 3 5 I ChA Non-inverting Input -IN B 6 12 I ChB Inverting Input +IN B 5 11 I ChB Non-inverting Input NC –– 2, 7, 10, 15 –– No Connection OUT A 1 3 O Output A OUT B 7 13 O Output B V- 4 6 I Negative Supply V+ 8 14 I Positive Supply (1) The maximum power dissipation is a function of T(JMAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (T(JMAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board. The value for RθJA is 106°C/W for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, RθJA for the 16-Pin SOIC is decreased to 70°C/W. 8-Pin SO PowerPAD package RθJA is with 2 in 2 heatsink (top and bottom layer each) and 1 oz. copper (see Table 2 and Application and Implementation ) Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM7372 |
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