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LM317KSTEEL bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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LM317KSTEEL bảng dữ liệu(HTML) 5 Page - Texas Instruments |
5 / 48 page LM117, LM317-N www.ti.com SNVS774P – MAY 2004 – REVISED OCTOBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Power dissipation Internally Limited Input-output voltage differential −0.3 40 V Metal package (soldering, 10 seconds) 300 °C Lead temperature Plastic package (soldering, 4 seconds) 260 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 7.2 ESD Ratings VALUE UNIT Electrostatic V(ESD) Human-body model (HBM)(1) ±3000 V discharge (1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher performance. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating temperature (LM117) −55 150 °C Operating temperature (LM317-N) 0 125 °C 7.4 Thermal Information, LM117 LM117 NDS NDT THERMAL METRIC(1) UNIT (TO-3) (TO) 2 PINS 3 PINS RθJA Junction-to-ambient thermal resistance(2) 39 186 °C/W RθJC(top) Junction-to-case (top) thermal resistance 2 21 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) No heatsink. Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM117 LM317-N |
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