LM741

SNOSC25D – MAY 1998 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

LM741, LM741A

±22

Supply voltage

V

LM741C

±18

500

mW

Differential input voltage

±30

V

±15

V

Output short circuit duration

Continuous

LM741, LM741A

–50

125

Operating temperature

°C

LM741C

0

70

LM741, LM741A

150

Junction temperature

°C

LM741C

100

PDIP package (10 seconds)

260

°C

Soldering information

CDIP or TO-99 package (10 seconds)

300

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For military specifications see RETS741X for LM741 and RETS741AX for LM741A.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

(5)

For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±400

V

(1)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows

safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

LM741, LM741A

±10

±15

±22

Supply voltage (VDD-GND)

V

LM741C

±10

±15

±18

LM741, LM741A

–55

125

Temperature

°C

LM741C

0

70

6.4 Thermal Information

LM741

LMC (TO-99)

NAB (CDIP)

P (PDIP)

UNIT

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

170

100

100

°C/W

Junction-to-case (top) thermal resistance

25

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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