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LM4510
SNVS533D – SEPTEMBER 2007 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2) (3)
MIN
MAX
UNIT
VIN
−0.3
6.5
V
VOUT
−0.3
21
V
SW(4)
–0.3
VOUT+0.3
V
EN, SS, COMP FB
−0.3
6.5
V
PGND to AGND
−0.2
0.2
V
Continuous power dissipation(5)
Internally
Limited
Junction temperature (TJ-MAX)
150
150
°C
Lead temperature (soldering, 10 sec)(6)
260
°C
(1)
Absolute maximum ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4)
This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3 V should not be applied to the VOUT or SW pins.
The absolute maximum specification applies to DC voltage. An extended negative voltage limit of –1 V applies for a pulse of up to 1 µs,
and –2 V for a pulse of up to 40 ns. An extended positive voltage limit of 22 V applies for a pulse of up to 20 ns.
(5)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (Typ.) and
disengages at TJ= 140°C (Typ.).
(6)
For detailed soldering information and specifications, please refer to Application Note 1187: Leadless Leadframe Package (LLP)
(SNOI401).
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-
2
kV
001, all pins(1)
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
1000
V
JESD22-C101, all pins(2)
Machine model
200
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
Supply voltage (VIN)
2.7
5.5
V
Junction temperature (TJ)
(1)
−40
125
°C
Output voltage (VOUT)
18
V
(1)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX)
4
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