LM26480QSQ-CFSLASHNOPB datasheet(5/39 Pages) TI1

tên linh kiện	LM26480QSQ-CF/NOPB

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LM26480-Q1

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SNVSA58A – JANUARY 2015 – REVISED JUNE 2016

Product Folder Links: LM26480-Q1

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions: Bucks. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (RθJA × PD-MAX). See Application and

Implementation.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VINLDO12, VIN1, AVDD, VIN2, VINLDO1, VINLDO2, ENSW1, FB1, FB2, ENSW2, ENLDO1,

ENLDO2, SYNC, FBL1, FBL2

−0.3

6

V

GND to GND SLUG

±0.3

Power dissipation, PD_MAX (TA = 85°C, TMAX = 125°C )

(3)

1.17

W

Junction temperature, TJ-MAX

150

°C

Maximum lead temperature (soldering)

260

Storage temperature, Tstg

−65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

7.3 Recommended Operating Conditions: Bucks

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

2.8

5.5

V

VEN

0

(VIN + 0.3 V)

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA (LM26480-Q1)

(1)

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

LM26480-Q1

UNIT

RTW (WQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

32.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

31.2

°C/W

RθJB

Junction-to-board thermal resistance

11.2

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

11.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.4

°C/W

Số phần tương tự - LM26480QSQ-CF/NOPB

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Texas Instruments	LM26480QSQ-CF/NOPB	6Mb / 37P	[Old version datasheet] LM26480 Externally Programmable Dual High-Current Step-Down DC/DC and Dual Linear Regulators

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Mô tả tương tự - LM26480QSQ-CF/NOPB

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Texas Instruments	LM26480	6Mb / 42P	[Old version datasheet] LM26480 Externally Programmable Dual High-Current Step-Down DC-DC and Dual Linear Regulators
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